Technologies

SELTEKA – reliable electronic manufacturing services in: pcb assembly

Technologies

-  SMD assembly

Average age of equipment is 6 years.

SMD department has three SMT lines, capable to assembly 0.122million smd/h.

Able to place all range of components: chip shooting from 01005, IC’s up to 56 x 56 x 22 mm height of the components up to 22 mm. Range: SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd-shape, surface-mount connectors, through-hole components, CSP, CCGA, LGA.

Largest dimensions of the printed board assembled on this line are 575 x 508 mm.

-  Reflow Oven soldering

Two ovens with lead free, leaded soldering paste and glue technology

-  Wave soldering

Four wave soldering machines with lead free and leaded technology

-  100 % AOI control

On client‘s request:

  • 100 % ICT testing;
  • 100 % functional testing;
  • 100 % climatic  testing from -40C to + 150C;
  • 100 % burning test

Services

- Design and production of technological equipment

Functionality testers for: cordless window vacuum cleaners, angle grinders, LED modules, washing machine control board and automatic watering equipment

- Washing

The washing processes of the assembled products take place using the washing machine. Internal dimensions of the washing bath: L=560 mm, B=360 mm, H=320 mm

- Varnishing

Used dip coating and automatic selective varnishing methods

- Filling with compound

- Box build

TH department has four assembly conveyors, from TH assembly to box build.  For box build using electric torque screwdrivers (0.5 – 2.5 N.m)

- Packaging and storage

Packed in our universal tare or tare designed based on customers requirements

- Mediate in the certification of products

Have experience in products testing according EC directives:

DIRECTIVE 2004/108/EC (EMC Directive);

DIRECTIVE 2006/95/EC (Low Voltage Directive);

DIRECTIVE 1999/5/EC (RTTE Directive)