Technologies

Automated surface mount technology (SMT)

UAB “Selteka” performs automated surface mount (SMT). Lead-free and leaded solder pastes are used; glue is applied using printers “MPM Momentum”, “MPM AP-25” and “AP-27”.

Construction of surface mount components with 2 highly productive equipment lines “Assembleon FCM-I” where productivity of one line is 65 thousand components per hour. Construction of surface mount components with flexible highly accurate equipment lines “MYDATA My100DX-10”, “My-15E” and  “My100DX-14” productivity of which is 45÷65 thousand components per hour.

Efficient equipment lines “MYDATA My100DX-10”, “My-15E” and “My100DX-14”

The following mounting is possible with the equipment lines “MYDATA My100DX-10”, “My-15E” and “My100DX-14”:

  • Passive components: smallest housing 01005Smallest is currently 0.4 x 0.2 mm. (0.01×0,005”-01005);
  • Wire components: minimum width of the wire: 0.05 mm, minimum wire spacing: 0.1 mm;
  • Components with spherical wires: minimum width of the wire: 0.08 mm, wire spacing: 0.16 mm;
  • Large components: largest dimensions:  56 x 56 x 15 mm, height of the components with individual adaptation: up to 22 mm;
  • Largest dimensions of the printed board assembled on this line are 575 x 508 mm.

Other technologies of UAB “Selteka”:

  • The technologies of UAB “Selteka” enable using leaded and lead-free reflow of solder paste in forced convection ovens “Ersa Hotflow 7/3” and “REHM VXS Nitro 2450 Type 523”.
  • Preparation of thermal processing modes by using the data recorder “Circuitmasters PROfiler”.
  • Inspection of the assembled printed board using the automated inspection equipment “SAKI BF18D-P40”.

Manual assembly

  • Manual assembly is performed at three conveyors or four production lines at choice with regard to complexity of the product and the volume of the order.
  • The lead-free soldering process takes place in nitrogen gas environment using wave soldering machines “Seho”, “Ersa”, “Soltec”.
  • The leaded soldering process takes place using the wave soldering machine “Ersa”.
  • Electric training and functional testing may be performed on the customer’s request.

Washing

The washing processes of the assembled products take place using the washing machine “Finnsonic” in the following technological order:

  • Circular washing with liquid that contains 30 % of activator;
  • Rinsing with hot domestic water (30-60 °C);
  • Rinsing with hot deionized water (30-60 °C);
  • Drying with hot air (80 °C).
  • The washing activator is chosen with regard to the particularity of the product and the customer’s wishes. We have got the most experience in working with the substances of the company “Zestron”.
  • Internal dimensions of the washing bath: L=560 mm, B=360 mm, H=320 mm.

Covering

  • The products are covered with acrylic cover by submersing them in the covering machine. The accuracy of submersion is 0.1 mm.
  • Internal dimensions of the covering bath: L=600 mm, B=250 mm, H=300 mm.

Development of technologies

Development of the technologies of UAB “Selteka” is an integral part of business. The company constantly optimizes the processes of activity. The company was acknowledged as one of the best Lithuanian companies and was awarded a prize of the national competition “Inovatyvi įmonė” for the business results thereof in 2007. UAB “Selteka” invested 2.65 million Lt (579,728.99 EUR) in development of technologies in 2010. It is strategically planned to invest over 1.15 million Lt (289,859.42 EUR) more in technologies during the period of 2011-2012. We guarantee high quality of the services to our customer because of our progressive attitude towards business.