Production lines

Flexible technological base of UAB “Selteka”:

• Flexible “Mydata” lines “SMT My100DX-10” and “My-15E”, “My100DX-14”;
• Two “FCM-I” lines from “PHILIPS” / “Assembleon”;
• Printers: “MPM Momentum”, “MPM AP25”, “AP27”;
• Hot-air soldering in the ovens “Ersa Hotflow 7/3” and “REHM VXS Nitro 2450 Type 523”.

PCB assembly lines “MYDATA My100DX-10”, “My-15E” and “My100DX-14”

Mounting of SMD elements is possible with the equipment lines “MYDATA My100DX-10”, “My-15E” and “My100DX-14”:

• Passive components: smallest housing 01005Smallest is currently 0.4 x 0.2 mm. (0.01×0,005”-01005);
• Wire components: minimum width of the wire: 0.05 mm, minimum wire spacing: 0.1 mm;
• Components with spherical wires: minimum width of the wire: 0.08 mm, wire spacing: 0.16 mm;
• Large components: largest dimensions:  56 x 56 x 15 mm, height of the components with individual adaptation: up to 22 mm;
• Maximum size of PCB is 575 x 508 mm.

Other production lines of UAB “Selteka”

• Leaded and lead-free soldering is performed using hot air and wave.
• Profiles of soldering temperature are checked by the recorder of temperature modes “PROfiler” from “Circuitmasters” (UK).
• The boards assembled are inspected by AOI equipment “BF18D-P40” (“SAKI Corporation”).
• Manual assembly lines, assembly of the final product.

Innovative attitude towards development of technologies

UAB “Selteka” constantly optimizes business processes by allotting 16.25 % of the income to innovative activity. The following new technological equipment was purchased during the last 5 years:

• 2006: automated surface mount equipment “My-15E” from the Swedish company “Mydata Automation AB”;
• 2007: automated optical inspection (AOI) equipment “BF-18D-P-40” from the Japanese company “Saki Corporation”;
• 2008: automated surface mount equipment “My100DX-10” from the Swedish company “Mydata Automation AB”.

The company invested 2.65 million Lt (579,728.99 EUR) in new technological equipment and purchased the following equipment in 2010:

• The oven “Rehm VXS Nitro 2450 Type 523” for reflow of solder pastes from the German company “Rehm”;
• Printer for application of solder pastes “Momentum” from the US company “MPM”;
• System “XT 5P” for automated repair of “BGA” components from the UK company “PDR”;
• Automated surface mount equipment “My100DX-14” from the Swedish company “Mydata Automation AB”.

It is strategically planned to invest over 1.15 million Lt (289,859.42 EUR) more in technologies during the period of 2011-2012.